About Me

Hi! I'm Yusuf, an Electrical & Electronics Engineering student at Abdullah Gül University and an undergraduate researcher at AGU PowerLab. My work focuses on power electronics, PCB hardware design, and embedded control systems.

On the embedded side, I work primarily with TI C2000 DSPs (F2800xx, F2837x, F2838x), STM32, and ESP32 using Real-Time Operating Systems (RTOS). I write digital power control loops, low-level drivers, and industrial communication firmware.

On the hardware side, I design multi-layer boards in Altium Designer and KiCAD, ranging from digital power converters (LLC, Boost PFC, MPPT) to DSP modules and EV control units. Before production, I validate my boards with 3D CAD, thermal analysis, EMI/EMC checks, and electromagnetic (FEA) simulations.

MCU & DSP TI C2000, STM32Fx/Gx, ESP32, FreeRTOS
Power Topologies LLC, Boost PFC, DAB, High Power Buck, Buck-Boost, Flyback
Design & Simulation Altium, KiCAD, PSIM, PLECS, LTspice, ANSYS Maxwell
Communication CAN / CAN-FD, Ethernet, EtherCAT, FSI, LIN, RS485

What I Do

  • PCB Design and Analysis

    PCB Design & Layout

    Clean, multi-layer schematic and PCB layout design for power and mixed-signal boards.

  • Electromagnetic FEA

    Electromagnetic FEA

    3D magnetic component design and finite element simulation for transformers and inductors.

  • Power Electronics

    Power Electronics

    High-efficiency AC/DC and DC/DC converter hardware design and prototype testing.

  • Control Systems

    Control Systems

    Real-time digital control loops and embedded DSP firmware for power conversion.

  • Thermal Optimization

    Thermal Optimization

    Cooling, heatsink, and copper-area optimization verified through thermal analysis.

  • EMI and EMC Compliance

    EMI/EMC

    Filter design and low-noise PCB routing to meet electromagnetic compatibility standards.

Experience

Education

  1. Abdullah Gül University - Electrical & Electronics Engineering

    2022 — Present

  2. Sumer Science High School

    2018 — 2022

Experience

  1. AGU Power Lab - Undergraduate Researcher

    2022 — Present

    As an undergraduate researcher I worked on many projects. Firstly, I worked for my university's electric vehicle project and I contributed all the electronics in the vehicle such as VCU, BMS, On-Board Charger(BoostPFC, FB LLC), Long Range Telemetry etc. After these projects, I focused on high efficiency MPPT boost converters, DSP modules, and modular power electronics projects.

    ● Electronics Hardware Design using KiCAD, Altium Designer.

    ● Digital Signal Processors and control algorithms.

    ● Software Development (GUI, Inventory Management)

    ● Simulation Tools (PLECS, PSIM, LTspice, MATLAB Simulink etc.)

    ● Gate Drivers for Wide-Bandgap Semiconductors (SiC/GaN)

  2. Hardware Consultant - Freelance

    2021 — Present

    ● Schematic Reviewing

    ● PCB Design

    ● BOM Suggestions

    ● System Design

    ● Firmware Consultancy

    ● Cost Reduction

    ● Thermal Analysis

    ● Test Board Design

    ● High Speed Hardware Design

  3. Fumaha Technology - Intern - Part Time

    2019 — 2021

    ● Industrial electronics repair - ABI BoardMaster

    ● CNC Operating

    ● Prototype PCB Manufacturing

    ● 3D CAD/CAM (Solidworks, Fusion)

    ● Hardware Design using KiCAD

    ● Schematics and Layout Reviewing

    ● Soldering

Publications

  1. System-level design and experimental demonstration of a laser power transfer system

    Optics & Laser Technology, Vol. 202, 115445 (2026)

    H. Yiğit, T. Boyekin, M. T. Kalebasi, A. Y. Sari, Y. Herdem, A. R. Boynuegri, B. Tekgun, T. Erdem, C. F. Kumru

    DOI: 10.1016/j.optlastec.2026.115445

Projects

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Engineering Calculators

Interactive engineering calculators developed for power electronics, PCB layout, resonant tanks, and thermal management. Real-time calculations with instant feedback.

PCB Trace Width & Current Capacity (IPC-2152)

Calculates required copper trace width, temperature rise, DC resistance, voltage drop, and power loss for high-power PCB routing based on IPC-2152 / IPC-2221 standards.

Design Inputs

A
°C
cm
°C

Routing Calculation

Required Trace Width
-- mm
≈ -- mils (thou)
Cross-Sectional Area -- mils²
Trace Resistance (R) -- mΩ
Voltage Drop (ΔV) -- mV
Power Dissipation (Ploss) -- W
IPC-2152 / IPC-2221 Governing Equations
Area A = (I / (k · ΔT^0.44))^(1/0.725) mils². For external copper, k = 0.048; for internal copper, k = 0.024. Thickness: 1 oz = 1.378 mils (35 µm). Temperature coefficient of copper: 0.00393 / °C.

DC-DC Converter Inductor & Capacitor Sizing

Calculate critical inductance, peak current, and minimum output capacitance for Buck, Boost, and Buck-Boost switch-mode power converters.

Operating Conditions

V
V
A
kHz
%
mV

Inductor & Filter Sizing

Recommended Inductance (Lmin)
-- µH
Continuous Conduction Mode (CCM)
Operating Duty Cycle (D) -- %
Peak Inductor Current (IL,pk) -- A
Average Inductor Current (IL,avg) -- A
Min. Output Capacitance (Cout,min) -- µF
Converter Design Equations
Buck: D = Vout / Vin, Lmin = (Vout · (1 - D)) / (ΔIL · fsw), Cout = ΔIL / (8 · fsw · ΔVout). Boost: D = (Vout - Vin) / Vout, Lmin = (Vin · D) / (ΔIL · fsw), Cout = (Iout · D) / (fsw · ΔVout).

LLC Resonant Tank & Impedance Calculator

Design and verify series resonant frequency (fr1), secondary magnetizing resonance (fr2), characteristic impedance (Zo), and loaded quality factor (Q) for LLC resonant converters.

Resonant Tank Parameters

µH
nF
µH
V
A
:1

Resonance & Tank Metrics

Series Resonant Freq (fr1)
-- kHz
Optimal Inductance Ratio (3 ≤ Lm/Lr ≤ 7)
Secondary Resonant Freq (fr2) -- kHz
Characteristic Impedance (Zo) -- Ω
Inductance Ratio (Lm / Lr) -- x
Loaded Quality Factor (Q) --
Equivalent AC Load (Rac) -- Ω
First Harmonic Approximation (FHA) Equations
fr1 = 1 / (2π · √(Lr · Cr)), fr2 = 1 / (2π · √((Lr + Lm) · Cr)), Zo = √(Lr / Cr), Rac = (8 · n² / π²) · (Vout / Iout), Q = Zo / Rac. Recommended inductance ratio: 3 ≤ Lm/Lr ≤ 7.

Thermal Resistance & Heat Sink Sizing

Calculate junction temperature and required heat sink thermal resistance (Rθsa) to maintain power semiconductors (MOSFET, SiC, GaN, IGBT) within safe operating limits.

Thermal Conditions

W
°C
°C
°C/W
°C/W

Thermal Budget Results

Max Heat Sink Resistance (Rθsa)
-- °C/W
Recommended Cooling Strategy
Max Total Resistance (Rθja) -- °C/W
Estimated Junction Temp (Tj) -- °C
Thermal Ohm's Law
Tj = Tamb + Pd · (Rθjc + Rθcs + Rθsa). Therefore: Rθsa,max = (Tj,max - Tamb) / Pd - (Rθjc + Rθcs). If Rθsa < 1.5 °C/W, forced air is typically required; for < 0.4 °C/W, liquid cooling is necessary.

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